Smartphones Might Have 64MP and 108MP Sensors Soon, Credit Suisse Predicts

Smartphones

A technology and market analysis paper by Credit Suisse predicts smartphones with image sensors of over 100MP to be appear soon.

Excerpt from the report:

  • Demand from Huawei (32MP CIS mass production) and Xiaomi (long-term contract) has helped Samsung to gain market share in CIS.
  • Multi-camera smartphones are expected to comprise 65–70% of all models in 2019, up from 40% in 2018. Triple-camera models are expected to account for as much as 20% of all smartphone handsets (up from 1.5% in 2018).
  • The multi-camera percentage for Samsung Mobile is expected to reach 70% in 2019 (up from 21% in 2018).
  • Demand for 5MP CIS is booming due to the trend toward multi-camera smartphones (the 5MP CIS is an essential component of triple-camera handsets).
  • The CIS technology roadmap calls for further evolution towards higher megapixels, with development expected to bring 64MP in 2H 2019 and 100MP in 2020. The trend will increase the number of lenses required (though weight is an issue), demanding higher levels of cooperation between lens, module and AP manufacturers to achieve incremental improvements in image resolution.
  • With Line 11 undergoing conversion, Samsung is planning to boost the total monthly capacity of its CIS 300mm production lines to 75,000 units by end-2019 and 85,000 units by end-2020. No decision has been taken yet on whether to convert Line 13 to CIS production, but the general plan is to continue expanding capacity steadily.
  • CIS 300mm line development is underway at SK Hynix.
[via Image Sensors World]

Industry News: Sony Develops A Stacked Global Shutter Sensor With Back-Illuminated Pixel

Global Shutter

Sony press release:

Sony Develops a Stacked CMOS Image Sensor Technology Using Sony’s Proprietary Global Shutter Function with Back-Illuminated Pixel Structure to Deliver Both High Imaging Performance and Miniaturization

Improves Productivity of Industrial Equipment for Smartification

Tokyo, Japan — Sony Corporation announced today that it has succeed in developing Pregius S, a stacked CMOS image sensor technology that employs Sony’s proprietary global shutter function with back-illuminated pixel structure to deliver both distortion-free, high imaging performance and miniaturization. The new sensor technology is intended for industrial equipment used in fields such as manufacturing, inspection, and logistics that require higher precision and higher processing speeds, in light of the trends in industrial advancement including factory smartification and automation.

Sony will introduce the new technology at Vision China Shanghai 2019 starting on March 20, 2019.

Conventional CMOS image sensors equipped with global shutter function temporarily store charge signals in the memory area located next to the photodiode to resolve image distortion (focal plane distortion) caused by the time shift due to the row-by-row readout. In front-illuminated CMOS image sensors, there is a wiring layer on the silicon substrate forming the photodiode, and with such a structure, the benefit is that it is easy to form a light shield for protecting the charge signal temporarily stored in the memory area from leaked light. For this reason, conventional CMOS image sensors with global shutter function have adopted a front-illuminated pixel structure. However, the wiring on top of the photodiode hinders the incident light, which creates an issue when attempting to miniaturize the pixels.

In response to this, Sony has developed a proprietary pixel structure that achieves the global shutter function on a back-illuminated structure that has superior sensitivity characteristics, thereby resolving the issue of miniaturization. Normally, when pixels are miniaturized, the sensitivity and saturation characteristics deteriorate, but the new Sony technology enables a reduction in pixel size to 2.74 μm while maintaining performance of those characteristic, thereby achieving about 1.7 times higher resolution than conventional front-illuminated CMOS image sensors.*1 This makes it possible to measure and inspect objects in a wider area and with higher accuracy in manufacturing, inspection, logistics and other applications. Moreover, thanks to the high degree of freedom of the wiring layout of back-illuminated pixel structures, a high speed of about 2.4 times that of conventional*1 can be achieved, thereby contributing to significant productivity improvement, including shorter measurement and inspection process times. In addition, the sensor’s stacked structure makes it possible to mount various signal processing circuits, whereby it is possible to realize smart functions such as signal processing only for the necessary part of the measurement and inspection images in a smaller size compared to conventional sensors.*1 That, in turn, makes it possible to reduce the load of the subsequent processing and reduce the amount of data to be held on to, thereby contributing to the realization of highly efficient, energy-saving systems.

Going forward, Sony will work to develop products equipped with this stacked CMOS image sensor employing its proprietary global shutter function with back-illuminated pixel structure for various industrial applications and intelligent transportation systems, including development of derivatives for signal processing circuits to be mounted. Sony plans to start shipping sample units in the summer of 2019 or later.

Main Features

1) Proprietary global shutter function with back-illuminated pixel structure delivers both distortion-free high imaging performance and miniaturization

Sony developed a proprietary pixel structure that achieves a global shutter function on a back-illuminated structure that has superior sensitivity characteristics, delivering both high imaging performance and miniaturization. By miniaturizing the pixel size from the conventional*1 3.45 μm to 2.74 μm while maintaining sensitivity and saturation characteristics, Sony has achieved about 1.7 times higher resolution than the conventional front-illuminated 12 megapixels*2 CMOS image sensor,*1 thereby making it possible to perform measurement and inspection in a wider area and at a higher accuracy. Moreover, thanks to the high degree of freedom of the wiring layout of the back-illuminated pixel structure, it is possible to deliver high-speed performance of about 2.4 times that of the conventional technology*1, thereby contributing to significant productivity improvement such as shorter measurement and inspection process times.

2) Miniaturization and high functionality made possible with a stacked structure

The sensor’s stacked structure makes it possible to mount various signal processing circuits, thereby contributing to miniaturization and enhanced functions for CMOS image sensors. Incorporating the data optimization functions (smart ROI, self-trigger, compression processing, compositing, etc.) that extracts only necessary information from the image data, it is possible to reduce the load of the subsequent processing and reduce the amount of data to be held onto while achieving a smaller package compared to conventional sensors,*1 thereby contributing to the realization of highly efficient, energy-saving systems.

Going forward, Sony will leverage the technology of Pregius S to further enhance and expand functions for new industries, including development of derivatives for signal processing circuits to be mounted.

Last 2 Days To Pre-Order Skylum AirMagic And Get $149 in Bonus Items

Skylum Airmagic

Skylum AirMagic will start ship on March 21, 2019.

Skylum AirMagic sells for $39 and will be released on March 21, 2019. If you preorder now you get $146 worth in bonus items:

  • Drone photography eBook by Skylum
  • ‘Shoot Professional Photos With Any Drone’ video course
  • AirMagic Premium Style
  • Lume Cube lightning Kit for Drone ($40 discount)

Firmware Update for Canon RF 35mm f/1.8 Macro IS Lens (ver. 2.0.0.)

Canon RF 35mm F/1.8 IS STM

Canon released firmware ver. 2.0.0 for the RF 35mm f/1.8 Macro IS for the EOS R system.

Firmware Notice: RF 35mm F/1.8 Macro IS STM: Firmware Version 2.0.0

Firmware Version 2.0.0 incorporates the following enhancement:

  • Support for the “panning” scene mode with the EOS RP has been added. The ”panning” scene mode reduces subject blurring and blurs the background when the lens is mounted to the EOS RP.

This firmware update is for lenses equipped with firmware version older than 2.0.0. If the lens firmware is already Version 2.0.0, it is not necessary to update the firmware.

The version of the lens firmware can be checked on the camera menu.


Support

Download Firmware Version 2.0.0 for the RF 35mm F1.8  Macro IS STM lens.

If you have not already done so, please register the RF 35mm F1.8  Macro IS STM lens. By registering, we will be able to notify you via email about future announcements.

Firmware Update for Canon RF 24-105mm F/4L IS lens (ver. 2.0.0.)

Canon RF 24-105mm F/4L IS Canon EOS R

Canon released a firmware update for the RF 24-105mm F/4L IS lens for the EOS R system

Firmware Notice RF 24-105mm F/4L IS USM Firmware Version 2.0.0

Firmware Version 2.0.0 incorporates the following enhancement:

  • Supports continuous shooting in silent shooting mode with the EOS R running Firmware Version 1.1.0 or later.

This firmware update is for lenses equipped with older firmware versions. If the lens’s firmware is already version 2.0.0, update is unnecessary.

The version of the lens firmware can be checked on the camera menu.

Notes:


Support

Download Firmware Version 2.0.0 for the RF 24-105mm F/4 L IS USM.

If you have not already done so, please register the RF 24-105mm F/4 L IS USM.  By registering, we will be able to notify you via email about future announcements.

Meike 35mm f/1.4 Manual Lens For APS-C Mirrorless Shipping Now

Meike 35mm F/1.4

Meike 35mm f/1.4 at a glance:

  • EF-M-Mount Lens/APS-C Format
  • 56mm (35mm Equivalent)
  • Aperture Range: f/1.4 to f/16
  • Multi-Layer Nano Coating
  • Manual Focus Design
  • Metal Lens Barrel and Bayonet Mount

The new Meike 35mm f/1.4 lens for mirrorless systems with an APS-C sensor (Canon EOS M included) is now shipping at major retailers.

Meike 35mm f/1.4 on sale at $109.99 at B&H PhotoAmazon USAmazon UKAmazon DE.